Copper Foil for Flexible Copper Clad Laminate 挠性覆铜板用铜箔
In order to speed up high frequency signal transmission, developing a high frequency copper foil laminate with lower dielectric constant has to start with two aspects. 为了实现高频信号传输高速化,进行了低介电常数层压式高频覆铜板基材的研制。
In this paper, the relation between molecular structure of polyvinyl acetal component and solder dip resistance and peel strength of adhesion was discussed and found the suitable molecular structure of polyvinyl acetal used as adhesive for copper foil laminate. 本文研究了聚乙烯缩醛的分子结构与铜箔粘合剂的耐焊热性、剥离强度的关系,找到了合适的分子结构。
The synthesis of the adhesive, coating on copper foil, production process of laminate are also discussed. 研究了胶粘剂的合成、铜箔涂胶及层压板制造等工艺。